Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101219 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | John Bruley, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2021-08-24 |
| 10985105 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | John Bruley, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2021-04-20 |
| 10957816 | Thin film wafer transfer and structure for electronic devices | Can Bayram, Christos D. Dimitrakopoulos, Jeehwan Kim, Hongsik Park, Devendra K. Sadana | 2021-03-23 |