Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081419 | Semiconductor package and a method of manufacturing the same | Dong Seong Oh, Si Hyeon Go | 2021-08-03 |
| 11011445 | Semiconductor package device | Moon Taek Sung | 2021-05-18 |
| 10910270 | Method of forming and packaging semiconductor die | Jin Won Jeong, Byeung Soo SONG, Dong Ki Shim, Jin Han BAE | 2021-02-02 |