Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10957816 | Thin film wafer transfer and structure for electronic devices | Jack O. Chu, Christos D. Dimitrakopoulos, Jeehwan Kim, Hongsik Park, Devendra K. Sadana | 2021-03-23 | $2,115,000 |