Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171009 | Processing method of wafer | Hiroyuki Takahashi, Kentaro WADA, Yoshio Watanabe | 2021-11-09 |
| 10896836 | Electrostatic chuck | Kenta Chito, Hidekazu Iida, Tomohiro Yamada, Yoshiteru Nishida, Hiroyuki Takahashi +1 more | 2021-01-19 |