Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203181 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Jie Bai, Yusuke Horiguchi, Tadashi Takano | 2021-12-21 |
| 10951536 | Sequence number recovery in stateful devices | Zhijun Liu | 2021-03-16 |
| 10913879 | Thermally conductive pre-applied underfill formulations and uses thereof | Jie Bai, Ly Do, YounSang Kim, Julissa Eckenrode | 2021-02-09 |
| 10892969 | Cluster wide packet tracing | — | 2021-01-12 |