Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10913879 | Thermally conductive pre-applied underfill formulations and uses thereof | Jie Bai, Ly Do, Hung The Chau, Julissa Eckenrode | 2021-02-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10913879 | Thermally conductive pre-applied underfill formulations and uses thereof | Jie Bai, Ly Do, Hung The Chau, Julissa Eckenrode | 2021-02-09 |