Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203181 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Yusuke Horiguchi, Hung The Chau, Tadashi Takano | 2021-12-21 |
| 11143019 | Real time estimation of fracture geometry from the poro-elastic response measurements | Dinesh Ananda Shetty | 2021-10-12 |
| 11132506 | System and method for segmenting a sentence | Xiulin LI | 2021-09-28 |
| 11016210 | Stimulated fracture network partitioning from microseismicity analysis | Jianfu Ma, Ken Huang | 2021-05-25 |
| 10935581 | Electric grid state estimation system and method based on boundary fusion | Huaguang Zhang, Jun Yang, Gang Wang, Qiuye Sun, Xinrui Liu +6 more | 2021-03-02 |
| 10927249 | Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof | Ly Do | 2021-02-23 |
| 10913879 | Thermally conductive pre-applied underfill formulations and uses thereof | Ly Do, Hung The Chau, YounSang Kim, Julissa Eckenrode | 2021-02-09 |