Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203181 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Jie Bai, Hung The Chau, Tadashi Takano | 2021-12-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203181 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Jie Bai, Hung The Chau, Tadashi Takano | 2021-12-21 |