Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203181 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Jie Bai, Yusuke Horiguchi, Hung The Chau | 2021-12-21 |
| 11148387 | Method for manufacturing intermediate material for soft packaging container, method for manufacturing soft packaging container, and method for manufacturing soft packaging container packaging body | Atsushi Yamamoto, Yoshinori Inagawa, Daisuke Kodama | 2021-10-19 |