Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114326 | Substrate chucking and dechucking methods | Wendell Glenn Boyd, Jr., Jim Zhongyi He, Robert T. Hirahara, Govinda Raj | 2021-09-07 |
| 11047035 | Protective yttria coating for semiconductor equipment parts | Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin A. PAPKE | 2021-06-29 |