Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11075165 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Rong Tao, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli +3 more | 2021-07-27 | $132,720,000 |