Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031273 | Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes | Ross Marshall, Tomoharu Matsushita, Cheng-Hsiung Tsai | 2021-06-08 |
| 10892180 | Lift pin assembly | Jallepally Ravi, Manjunatha Koppa, Vinod Konda Purathe, Cheng-Hsiung Tsai, Aravind Kamath | 2021-01-12 |