Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11031273 | Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes | Bonnie T. Chia, Tomoharu Matsushita, Cheng-Hsiung Tsai | 2021-06-08 | $87,142,000 |