Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018079 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Ji Young Chung | 2021-05-25 |
| 11011455 | Electronic package structure with improved board level reliability | Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang | 2021-05-18 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2021-02-02 |