Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152296 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi +5 more | 2021-10-19 |
| 11145588 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2021-10-12 |
| 11018079 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2021-05-25 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2021-02-02 |