Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101540 | Semiconductor devices and methods of manufacturing semiconductor devices | Tae Yong Lee, Doo Soub Shin, Seon Ae Lee, Woo Bin Jung, Ji Yeon Ryu +1 more | 2021-08-24 |
| 11075170 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2021-07-27 |
| 11018079 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2021-05-25 |