Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11136449 | Thermoplastic resin composition | Gi Sun Kim | 2021-10-05 |
| 11101540 | Semiconductor devices and methods of manufacturing semiconductor devices | Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Woo Bin Jung, Ji Yeon Ryu +1 more | 2021-08-24 |