Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145588 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2021-10-12 |
| 11114369 | Semiconductor device and manufacturing method thereof | Kwang Seok Oh | 2021-09-07 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2021-02-02 |