Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011455 | Electronic package structure with improved board level reliability | Tae Kyung Hwang, Won Joon Kang, Gi Jeong Kim | 2021-05-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011455 | Electronic package structure with improved board level reliability | Tae Kyung Hwang, Won Joon Kang, Gi Jeong Kim | 2021-05-18 |