Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840125 | Memory structure and method for forming the same | Jin Wen Dong, Jun Chen, Zhiliang Xia, Jifeng Zhu, He Chen | 2020-11-17 |
| 10784225 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Li Xiao | 2020-09-22 |
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2020-08-18 |
| 10727056 | Method and structure for cutting dense line patterns using self-aligned double patterning | Lu Fan, Bi Feng Li, Qingchen Cao, Yaobin Feng, Zhiliang Xia +1 more | 2020-07-28 |