Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Elena Lawrence, Eric Kurt Zwirnmann +1 more | 2020-02-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Elena Lawrence, Eric Kurt Zwirnmann +1 more | 2020-02-04 |