Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | John Taddei, John Clark, Elena Lawrence, Eric Kurt Zwirnmann, David Goldberg +1 more | 2020-02-04 |
| 10541180 | Apparatus and method for wafer thinning in advanced packaging applications | John Taddei, John Clark, Kenji Nulman | 2020-01-21 |