Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707099 | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle | William Gilbert Breingan, Chris Hofmeister | 2020-07-07 |
| 10559488 | Two-level tape frame rinse assembly | William Gilbert Breingan, James Swallow | 2020-02-11 |
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Clark, Elena Lawrence, Eric Kurt Zwirnmann, David Goldberg +1 more | 2020-02-04 |
| 10541180 | Apparatus and method for wafer thinning in advanced packaging applications | Laura Mauer, John Clark, Kenji Nulman | 2020-01-21 |