Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Elena Lawrence, David Goldberg +1 more | 2020-02-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Elena Lawrence, David Goldberg +1 more | 2020-02-04 |