Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804233 | Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height | Viren Khandekar, Karthik Thambidurai | 2020-10-13 |
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Qiao Chen | 2020-06-02 |