Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804233 | Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height | Viren Khandekar, Vivek Swaminathan Sridharan | 2020-10-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804233 | Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height | Viren Khandekar, Vivek Swaminathan Sridharan | 2020-10-13 |