Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2020-06-02 |