Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2020-06-02 |
| 10615057 | Encapsulation process for semiconductor devices | Leonard George Chorosinski, Parrish E. Ralston | 2020-04-07 |