Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2020-07-28 |