WC

Wen-Ting Chu

TSMC: 18 patents #67 of 3,471Top 2%
Overall (2020): #2,468 of 565,922Top 1%
18
Patents 2020

Issued Patents 2020

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
10868250 Resistance variable memory structure and method of forming the same Kuo-Chi Tu, Chih-Yang Chang, Hsia-Wei Chen, Chin-Chieh Yang, Sheng-Hung Shih +2 more 2020-12-15
10862029 Top electrode for device structures in interconnect Hsia-Wei Chen, Kuo-Chi Tu, Chih-Yang Chang, Chin-Chieh Yang, Yu-Wen Liao +2 more 2020-12-08
10811600 Switching layer scheme to enhance RRAM performance Hai-Dang Trinh, Cheng-Yuan Tsai, Hsing-Lien Lin 2020-10-20
10796759 Method and apparatus for reading RRAM cell Chin-Chieh Yang, Chih-Yang Chang, Chang-Sheng Liao, Hsia-Wei Chen, Jen-Sheng Yang +4 more 2020-10-06
10763426 Method for forming a flat bottom electrode via (BEVA) top surface for memory Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih +3 more 2020-09-01
10763270 Method for forming an integrated circuit and an integrated circuit Tzu-Yu Chen, Kuo-Chi Tu, Yong-Shiuan Tsair 2020-09-01
10762960 Resistive random access memory device Yu-Der Chih, Chung-Cheng Chou 2020-09-01
10749108 Logic compatible RRAM structure and process Chih-Yang Chang, Hsia-Wei Chen, Chin-Chieh Yang, Kuo-Chi Tu, Yu-Wen Liao 2020-08-18
10727337 Semiconductor device and manufacturing method thereof Kuo-Chi Tu, Jen-Sheng Yang, Sheng-Hung Shih, Tong-Chern Ong 2020-07-28
10727275 Memory layout for reduced line loading Chih-Yang Chang 2020-07-28
10714536 Method to form memory cells separated by a void-free dielectric structure Hsia-Wei Chen, Yu-Wen Liao 2020-07-14
10700275 RRAM cell structure with laterally offset BEVA/TEVA Chih-Yang Chang, Kuo-Chi Tu, Yu-Wen Liao, Hsia-Wei Chen, Chin-Chieh Yang +2 more 2020-06-30
10686125 Memory device Harry-Hak-Lay Chuang, Hung Cho Wang, Tong-Chern Ong, Yu-Wen Liao, Kuei-Hung Shen +2 more 2020-06-16
10680038 RRAM memory cell with multiple filaments Chin-Chieh Yang, Chih-Yang Chang, Yu-Wen Liao 2020-06-09
10622300 Series MIM structures Kuo-Chi Tu, Chin-Chieh Yang 2020-04-14
10566387 Interconnect landing method for RRAM technology Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Kuo-Chi Tu +1 more 2020-02-18
10566519 Method for forming a flat bottom electrode via (BEVA) top surface for memory Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih +3 more 2020-02-18
10529658 Method for forming a homogeneous bottom electrode via (BEVA) top surface for memory Hsia-Wei Chen, Yu-Wen Liao 2020-01-07