HC

Hsia-Wei Chen

TSMC: 12 patents #154 of 3,471Top 5%
Overall (2020): #6,331 of 565,922Top 2%
12
Patents 2020

Issued Patents 2020

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10868250 Resistance variable memory structure and method of forming the same Kuo-Chi Tu, Chih-Yang Chang, Chin-Chieh Yang, Sheng-Hung Shih, Wen-Chun You +2 more 2020-12-15
10862029 Top electrode for device structures in interconnect Wen-Ting Chu, Kuo-Chi Tu, Chih-Yang Chang, Chin-Chieh Yang, Yu-Wen Liao +2 more 2020-12-08
10796759 Method and apparatus for reading RRAM cell Chin-Chieh Yang, Chih-Yang Chang, Chang-Sheng Liao, Jen-Sheng Yang, Kuo-Chi Tu +4 more 2020-10-06
10763426 Method for forming a flat bottom electrode via (BEVA) top surface for memory Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more 2020-09-01
10749108 Logic compatible RRAM structure and process Chih-Yang Chang, Chin-Chieh Yang, Kuo-Chi Tu, Wen-Ting Chu, Yu-Wen Liao 2020-08-18
10720581 Barrier layer for resistive random access memory Tzu-Chung Tsai, Yan Chen 2020-07-21
10714536 Method to form memory cells separated by a void-free dielectric structure Wen-Ting Chu, Yu-Wen Liao 2020-07-14
10700275 RRAM cell structure with laterally offset BEVA/TEVA Chih-Yang Chang, Wen-Ting Chu, Kuo-Chi Tu, Yu-Wen Liao, Chin-Chieh Yang +2 more 2020-06-30
10636961 Semiconductor structure and method of forming the same Harry-Hak-Lay Chuang, Hung Cho Wang, Kuei-Hung Shen 2020-04-28
10566519 Method for forming a flat bottom electrode via (BEVA) top surface for memory Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more 2020-02-18
10566387 Interconnect landing method for RRAM technology Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more 2020-02-18
10529658 Method for forming a homogeneous bottom electrode via (BEVA) top surface for memory Wen-Ting Chu, Yu-Wen Liao 2020-01-07