Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872873 | Method for bonding wafers and bonding tool | Chien-Chih Chen, Chung-I Hung, Mu-Han Cheng, Tzu-Shin Chen, Su-Yu Yeh | 2020-12-22 |
| 10847394 | Wafer container with a seal | Ming-Long Chiu, Yen-Fang Chen, Chia-Ling Li | 2020-11-24 |