Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879289 | Method for forming a semiconductor device | Chin-Yu Lin, Keng-Ying Liao, Huai-Jen Tung, Po-Zen Chen, Chia-Yun Chen +1 more | 2020-12-29 |
| 10872873 | Method for bonding wafers and bonding tool | Chien-Chih Chen, Tsung-Yi Yang, Chung-I Hung, Mu-Han Cheng, Tzu-Shin Chen | 2020-12-22 |