Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872873 | Method for bonding wafers and bonding tool | Chien-Chih Chen, Tsung-Yi Yang, Mu-Han Cheng, Tzu-Shin Chen, Su-Yu Yeh | 2020-12-22 |
CH
Chung-I Hung
Overall (2020): #517,673 of 565,922Top 95%
1
Patents 2020