Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872873 | Method for bonding wafers and bonding tool | Chien-Chih Chen, Tsung-Yi Yang, Chung-I Hung, Tzu-Shin Chen, Su-Yu Yeh | 2020-12-22 |
| 10792783 | System, control method and apparatus for chemical mechanical polishing | Hsiang-Chu Hu, Chun-Hai Huang, Yu-Chin Tseng, Chien-Chih Chen, Tzu-Shin Chen | 2020-10-06 |