Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867800 | Method of forming an interconnect structure having a carbon-containing barrier layer | Ya-Lien Lee, Chun-Chieh Lin, Hung-Wen Su | 2020-12-15 |
| 10840105 | Gate structure with insulating structure and method for manufacturing the same | Yu-Hung Lin, Hon-Lin Huang, Shih-Chi Lin, Sheng-Hsuan Lin | 2020-11-17 |
| 10714329 | Pre-clean for contacts | Yu-Ting Lin, Chen-Yuan Kao, Yu-Sheng Wang, I-Li Chen, Hong-Ming Wu | 2020-07-14 |
| 10529575 | Interconnect structure having a carbon-containing barrier layer | Ya-Lien Lee, Chun-Chieh Lin, Hung-Wen Su | 2020-01-07 |