Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867800 | Method of forming an interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2020-12-15 |
| 10790142 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hsiao-Kuan Wei, Pei-Hsuan Lee, Hsin-Yun Hsu, Jui-Fen Chien | 2020-09-29 |
| 10770288 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Pei-Hsuan Lee, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2020-09-08 |
| 10727350 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2020-07-28 |
| 10692814 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Ming-Hsing Tsai, Syun-Ming Jang | 2020-06-23 |
| 10529575 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2020-01-07 |