Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840134 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2020-11-17 |
| 10818598 | Methods for reducing dual damascene distortion | Chao-Chun Wang, Chung-Chi Ko | 2020-10-27 |
| 10727350 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo +1 more | 2020-07-28 |
| 10707165 | Semiconductor device having an extra low-k dielectric layer and method of forming the same | Chia-Cheng Chou, Li Chun Te | 2020-07-07 |