Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867800 | Method of forming an interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2020-12-15 |
| 10741442 | Barrier layer formation for conductive feature | Chia-Pang Kuo | 2020-08-11 |
| 10672652 | Gradient atomic layer deposition | Chia-Pang Kuo | 2020-06-02 |
| 10529575 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2020-01-07 |