Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811316 | Method and system of forming integrated circuit | Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng | 2020-10-20 |
| 10720339 | Fan-out wafer-level packaging method and the package produced thereof | Masaya Kawano | 2020-07-21 |
| 10665550 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2020-05-26 |