Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879227 | Electronic device | Yoichiro Kurita, Koji Soejima | 2020-12-29 |
| 10720339 | Fan-out wafer-level packaging method and the package produced thereof | Ka Fai Chang | 2020-07-21 |
| 10580763 | Electronic device | Yoichiro Kurita, Koji Soejima | 2020-03-03 |