Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879227 | Electronic device | Masaya Kawano, Koji Soejima | 2020-12-29 |
| 10847497 | Bonding method of semiconductor chip and bonding apparatus of semiconductor chip | — | 2020-11-24 |
| 10672750 | Semiconductor device | — | 2020-06-02 |
| 10658338 | Semiconductor device including a re-interconnection layer and method for manufacturing same | Takayuki TAJIMA, Kazuo Shimokawa | 2020-05-19 |
| 10580763 | Electronic device | Masaya Kawano, Koji Soejima | 2020-03-03 |
| 10566219 | Chip transfer member, chip transfer apparatus, and chip transfer method | Tomoyuki Abe, Hideto Furuyama | 2020-02-18 |