DY

De-Wei Yu

TSMC: 9 patents #242 of 3,471Top 7%
📍 Lileng, TW: #1 of 3 inventorsTop 35%
Overall (2020): #11,856 of 565,922Top 3%
9
Patents 2020

Issued Patents 2020

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
10868140 Gap-filling germanium through selective bottom-up growth Chien-Hao Chen, Ziwei Fang, Yee-Chia Yeo 2020-12-15
10868137 Semiconductor device and method Cheng-Po Chau, Yun Chen Teng 2020-12-15
10861751 Method of semiconductor integrated circuit fabrication Chia Ping Lo, Liang-Gi Yao, Weng Chang, Yee-Chia Yeo, Ziwei Fang 2020-12-08
10784106 Selective film growth for bottom-up gap filling Yu-Lien Huang 2020-09-22
10741674 Selective silicon growth for gapfill improvement Chien-Hao Chen, Pin-Ju Liang, I-Chen Yang 2020-08-11
10727064 Post UV cure for gapfill improvement Chien-Hao Chen, Chih-Tang Peng, Jei-Ming Chen, Shu-Yi Wang 2020-07-28
10685867 Method of semiconductor integrated circuit fabrication Tsu-Hsiu Perng, Ziwei Fang 2020-06-16
10535557 Interlayer dielectric film in semiconductor devices Tsan-Chun Wang, Ziwei Fang, Yi-Fan Chen 2020-01-14
10535751 Selective silicon growth for gapfill improvement Chien-Hao Chen, Pin-Ju Liang, I-Chen Yang 2020-01-14