Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840154 | Method for forming semiconductor structure with high aspect ratio | Han-Pin Chung, Tien-I Bao | 2020-11-17 |
| 10727064 | Post UV cure for gapfill improvement | De-Wei Yu, Chien-Hao Chen, Jei-Ming Chen, Shu-Yi Wang | 2020-07-28 |
| 10707114 | Method of forming isolation layer | Teng-Chun Tsai, Bing Chen, Chien-Hsun Wang, Cheng-Tung Lin, De-Fang Chen +3 more | 2020-07-07 |
| 10643902 | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate | Yen-Chun Huang, Bang-Tai Tang, Tai-Chun Huang | 2020-05-05 |