Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672866 | Seamless gap fill | Bor Chiuan Hsieh, Pei-Ren Jeng, Tai-Chun Huang, Tze-Liang Lee | 2020-06-02 |
| 10643902 | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate | Bang-Tai Tang, Chih-Tang Peng, Tai-Chun Huang | 2020-05-05 |