Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10858495 | Polymer hybrid material for use in a splitting method | Christian Beyer, Marko Swoboda | 2020-12-08 |
| 10843380 | Method for the material-saving production of wafers and processing of wafers | Franz Schilling, Wolfram Drescher | 2020-11-24 |
| 10707068 | Combined wafer production method with a multi-component receiving layer | Christian Beyer, Anas Ajaj | 2020-07-07 |
| 10676386 | Method for guiding a crack in the peripheral region of a donor substrate | Marko Swoboda, Christian Beyer, Franz Schilling | 2020-06-09 |
| 10664996 | Method and apparatus for the start-up operation of a multi-axis system | Mehdi Hamadou, Maximilian Walter | 2020-05-26 |
| 10593590 | Combined wafer production method with laser treatment and temperature-induced stresses | Wolfram Drescher, Christian Beyer | 2020-03-17 |