Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843380 | Method for the material-saving production of wafers and processing of wafers | Franz Schilling, Jan Richter | 2020-11-24 |
| 10825732 | Method of producing stresses in a semiconductor wafer | Lukas Lichtensteiger | 2020-11-03 |
| 10593590 | Combined wafer production method with laser treatment and temperature-induced stresses | Jan Richter, Christian Beyer | 2020-03-17 |
| 10580699 | Method and device for the production of wafers with a pre-defined break initiation point | Lukas Lichtensteiger | 2020-03-03 |