Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10858495 | Polymer hybrid material for use in a splitting method | Jan Richter, Marko Swoboda | 2020-12-08 |
| 10724889 | Liquid level detection in receptacles using a plenoptic camera to measure the surface topography of the liquid | Helmut Knapp, Philipp Schmid, Matthias Höchemer, Vincent Revol | 2020-07-28 |
| 10707068 | Combined wafer production method with a multi-component receiving layer | Jan Richter, Anas Ajaj | 2020-07-07 |
| 10676386 | Method for guiding a crack in the peripheral region of a donor substrate | Marko Swoboda, Franz Schilling, Jan Richter | 2020-06-09 |
| 10661392 | Splitting of a solid using conversion of material | — | 2020-05-26 |
| 10593590 | Combined wafer production method with laser treatment and temperature-induced stresses | Wolfram Drescher, Jan Richter | 2020-03-17 |