Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707068 | Combined wafer production method with a multi-component receiving layer | Jan Richter, Christian Beyer | 2020-07-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707068 | Combined wafer production method with a multi-component receiving layer | Jan Richter, Christian Beyer | 2020-07-07 |