Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879204 | Bump structures for high density flip chip interconnection | Wei Zhang, Wei Huang, Joshua Lund | 2020-12-29 |
| 10727267 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Wei Huang, Paul L. Bereznycky | 2020-07-28 |
| 10622324 | Bump structures for high density flip chip interconnection | Wei Zhang, Wei Huang, Joshua Lund | 2020-04-14 |
| 10566371 | Bump structures for interconnecting focal plane arrays | Wei Huang | 2020-02-18 |